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 E2E0012-27-Y3 Semiconductor
This version: Jan. 1998 Previous version: Mar. 1996 MSM6353/6353L-xx
Semiconductor MSM6353/6353L-xx
Built-in 8 or 5 bit Serial Port 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6353/6353L is a low-power 4-bit microcontroller manufactured in CMOS process technology. It is best suited for the control of battery-driven equipment. The built-in 8-bit or 5-bit serial port provides a data communication capability with external apparatus.
FEATURES
* Low power consumption * Large capacity memory * ROM : 4096 words 15 bits * RAM : 1024 words 4 bits * I/O port Input-output port : 5 ports 4 bits (input or output can be specified for each port) * 1.5 V single-power-supply operation (MSM6353) Can be changed to 3.0 V specification by mask option (MSM6353L). * Built-in watchdog timer * Built-in serial port of 8 bits or 5 bits (asynchronous) * 32.768 kHz built-in crystal oscillator circuit * Package options: 42-pin shrink DIP (SDIP42-P-600-1.78) (Product name: MSM6353-xxSS, MSM6353L-XXSS) 44-pin plastic QFP (QFP44-P-910-0.80-K) (Product name:MSM6353-xxGS-K, MSM6353L-XXGS-K) (QFP44-P-910-0.80-2K) (Product name: MSM6353-xxGS-2K,MSM6353L-XXGS-2K) xx indicates the code number.
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SIN
SOUT SCLK
SERIAL I/O ACC SBFF u P02C SBFFl SCNT SCND P01C P00C FLAG ALU
PORT0
BLOCK DIAGRAM
Semiconductor
P0.0 P0.1 P0.2 P0.3
P03C
P1.0 P1.1 P1.2 P1.3
D-BUS
PORT1
P3 C P2 C P1 C
P4 C
BANK
PORT2
P2.0-2.3
P2.0 P2.1 P2.2 P2.3 EIRT INTERRUPT CONTROL
IRQEX
WATCHDOG TIMER DATA RAM VDD 1024 4 bits
IRQRT IEXM0 IEXM1 IEXM2
PAGE
WDOG 0
WDOG 1
PORT3 FRMT
P3.0 P3.1 P3.2 P3.3
WORK
PROGRAM ROM 4096 15 bits
PORT4
PROGRAM COUNTER
P4.0 P4.1 P4.2 P4.3 TMOUT ADDER
INSTRUCTION REGISTER
XTOUT
TIME BASE COUNTER
XT
OSC
XT INSTRUCTION DECODER
RESET
SYSTEM CLOCK GENERATOR
STACK
TEST1 TEST2 TEST3
VOLTAGE CONVERTER REGURATOR VCP VCM
VSS1 VSS2 VEE
MSM6353/6353L-xx
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Semiconductor
MSM6353/6353L-xx
PIN CONFIGURATION (TOP VIEW)
VDD VSS2 VSS1 VEE NC VCP VCM NC SOUT
1 2 3 4 5 6 7 8 9
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
XT XT XTOUT P1.0 P1.1 P1.2 P1.3 NC TEST3 TEST2 TEST1 RESET P4.3 P4.2 P4.1 P4.0 NC P3.3 P3.2 P3.1 P3.0
SIN 10 SCLK 11 NC 12 P0.0 13 P0.1 14 P0.2 15 P0.3 16 NC 17 P2.0 18 P2.1 19 P2.2 P2.3 20 21
NC : No-connection pin 42-Pin Shrink DIP
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Semiconductor
MSM6353/6353L-xx
PIN CONFIGURATION (TOP VIEW) (Continued)
35 XTOUT 41 VSS1 40 VSS2 34 P1.0
33 P1.1 32 P1.2 31 P1.3 30 TEST3 29 TEST2 28 TEST1 27 RESET 26 P4.3 25 P4.2 24 P4.1 23 P4.0
39 VDD
38 VDD P3.0 18
42 VEE
44 NC
43 NC
37 XT P3.1 19
NC VCP VCM NC SOUT SIN SCLK P0.0 P0.1
1 2 3 4 5 6 7 8 9
P0.2 10 P0.3 11
NC 12
P2.0 13
P2.1 14
P2.2 15
P2.3 16
P2.3 17
P3.2 20
36 XT
P3.3 21
NC : No-connection pin 44-Pin Plastic QFP
NC 22
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Semiconductor
MSM6353/6353L-xx
ABSOLUTE MAXIMUM RATINGS (MSM6353, 1.5 V)
VDD=0 V (VSS1=VSS2=battery voltage) Parameter Power Supply Voltage Input Voltage Output Voltage Storage Temperature Symbol VSS1 VIN VOUT TSTG -- Condition Ta=25C Rating -6.0 to +0.3 VSS-0.3 to VSS+0.3 VSS-0.3 to VSS+0.3 -55 to +125 C V Unit
RECOMMENDED OPERATING CONDITIONS (MSM6353, 1.5 V)
VDD=0 V (VSS1=VSS2=battery voltage) Parameter Operating Voltage Operating Temperature Operating Frequency Symbol Vop Top fOSC Condition BUF=Fixed to "0" -- -- Range -1.25 to -1.75 -20 to +70 32.768 Unit V C kHz
ELECTRICAL CHARACTERISTICS (MSM6353, 1.5 V)
DC Characteristics
(VDD=0 V, VSS1=VSS2=-1.5 V (battery voltage), fOSC=32,768 Hz, CX=35 pF, Ta=25C) Parameter Current Consumption
Oscillation Start Voltage
Symbol IDD -VOSC -IOH1 IOL1 -IOH2 IOL2 -IIH1 | IIL2 | -IIL3 -VIH -VIL *1 *2
Condition Within 2 sec. VO=-0.5 V VO=-1.0 V VO=-0.5 V VO=-1.0 V VI=0 V, input state, with pull-down resistor VI=0V, -1.5 V, input state, without pull-down resistor VI=0 V, with pull-down resistor -- --
Min. Typ. Max. Unit Applied Pin -- -- 150 150 7 20 75 -- -- -- 1.2 3.0 -- -- -- -- -- 150 -- 4 -- -- -- 1.4 -- -- -- -- 300 1 -- 0.3 -- mA V mA -- --
PORT0 to PORT4*3 SOUT, SCLK, XTOUT
Output Current 1 Output Current 2 Input Current 1 Input Leakage Current Input Current 3 Input Voltage
mA BD mA mA
PORT0 to PORT4 PORT0 to PORT4 SCLK, SIN, SOUT
mA RESET V All input pins
*1 This value depends on program. *2 Backup flag (BUF)=fixed to "0". *3 PORT0=P0.0-P0.3, PORT1=P1.0-P1.3, PORT2=P2.0-P2.3, PORT3=P3.0-P3.3, PORT4=P4.0P4.3.
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Semiconductor
MSM6353/6353L-xx
ABSOLUTE MAXIMUM RATINGS (MSM6353L, 3.0 V)
VDD=0 V (VSS1=VSS2=battery voltage) Parameter Power Supply Voltage Input Voltage Output Voltage Storage Temperature Symbol VSS1 VIN VOUT TSTG -- Condition Ta=25C Rating -6.0 to +0.3 VSS-0.3 to VSS+0.3 VSS-0.3 to VSS+0.3 -55 to +125 C V Unit
RECOMMENDED OPERATING CONDITIONS (MSM6353L, 3.0 V)
VDD=0 V (VSS1=VSS2=battery voltage) Parameter Operating Voltage Operating Temperature Operating Frequency Symbol Vop Top fOSC Condition BUF=Fixed to "1" -- -- Range -2.2 to -3.5 -20 to +70 32.768 Unit V C kHz
ELECTRICAL CHARACTERISTICS (MSM6353L, 3.0 V)
DC Characteristics
(VDD=0 V, VSS1=VSS2=-3.0 V (battery voltage), fOSC=32,768 Hz, CX=35 pF, Ta=25C) Parameter Current Consumption
Oscillation Start Voltage
Symbol IDD -VOSC -IOH1 IOL1 -IOH2 IOL2 -IIH1 | IIL2 | -IIL3 -VIH -VIL *1 *2
Condition Within 2 sec. VO=-0.5 V VO=-2.5 V VO=-0.5 V VO=-2.5 V VI=0 V, input state, with pull-down resistor VI=0 V, -3 V, input state, without pull-down resistor VI=0 V, with pull-down resistor -- --
Min. Typ. Max. Unit Applied Pin -- -- 500 500 7 20 150 -- -- -- 2.5 3.0 -- -- -- -- -- 300 -- 25 -- -- -- 2.4 -- -- -- -- 600 1 -- 0.5 -- mA V mA -- --
PORT0 to PORT4*3 SOUT, SCLK, XTOUT
Output Current 1 Output Current 2 Input Current 1 Input Leakage Current Input Current 3 Input Voltage
mA BD mA mA
PORT0 to PORT4 PORT0 to PORT4 SCLK, SIN, SOUT
mA RESET V All input pins
*1 This value depends on program. *2 Backup flag (BUF)=fixed to "1". *3 PORT0=P0.0-P0.3, PORT1=P1.0-P1.3, PORT2=P2.0-P2.3, PORT3=P3.0-P3.3, PORT4=P4.0P4.3.
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Semiconductor
MSM6353/6353L-xx
PACKAGE DIMENSIONS
(Unit : mm)
SDIP42-P-600-1.78
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 4.52 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
7/9
Semiconductor
MSM6353/6353L-xx
(Unit : mm)
QFP44-P-910-0.80-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.35 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
8/9
Semiconductor
MSM6353/6353L-xx
(Unit : mm) QFP44-P-910-0.80-2K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.41 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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